Christoph Hecht

Lehrstuhl für Fertigungsautomatisierung und Produktionssystematik

Wissenschaftliche Mitarbeitende

Adresse

Fürther Straße 246b 90429 Nürnberg

Publikationen

Utsch D., Turowski T., Hecht C., Thielen N., Ockel M., Franke J., Risch F.:
Laser-Based Powder Bed Fusion of Copper Powder on Aluminum Nitride Ceramics for Power Electronic Applications
In: Ceramics 8 (2025), p. 105
ISSN: 2571-6131
DOI: 10.3390/ceramics8030105

Hecht C., Ockel M., Stoll T., Franke J.:
Fabrication of metal-ceramic substrates by laser powder bed fusion using a high-power green laser and high temperature preheating
SPIE LASE (San Francisco)
In: Proceedings Volume 12876, Laser 3D Manufacturing XI 2024
DOI: 10.1117/12.3001350
Hecht C., Sprenger M., Franke J.:
Laser powder bed fusion of titanium alloyed copper powder for power electronic substrates
47th International Spring Seminar on Electronics Technology, ISSE 2024 (Prague, CZE, 15. Mai 2024 - 19. Mai 2024)
In: Proceedings of the International Spring Seminar on Electronics Technology 2024
DOI: 10.1109/ISSE61612.2024.10603471

Hecht C., Häußler F., Schadow E., Stoll T., Sprenger M., Franke J.:
Additive metallization of alumina with copper-titanium powder blends for power electronic applications
In: Advancing Microelectronics 2023 (2023), p. 129-134
ISSN: 2222-8748
DOI: 10.4071/001c.94698
Hecht C., Schadow E., Sprenger M., Häußler F., Stoll T., Franke J.:
Additive Metallization of Alumina with Copper-Titanium Powder Blends for Power Electronic Applications
24th European Microelectronics and Packaging Conference, EMPC 2023 (Hinxton, 11. September 2024 - 14. November 2024)
In: IMAPSource Proceedings 2023 (EMPC) 2023
DOI: 10.23919/EMPC55870.2023.10418396
Hecht C., Schüller D., Utsch D., Stoll T., Franke J.:
Investigations on processing copper-titanium powder blends via PBF-LB/M
In: Lasers in Manufacturing, 2023
URL: https://wlt.de/sites/default/files/2023-09/Contribution_112.pdf
Ockel M., Sippel M., Hecht C., Janisch L., Franke J.:
A Conceptional Study towards Developing a Novel Copper Top-Side Interconnection Process in Power Electronics using Additive Manufacturing
DOI: 10.1109/EPTC59621.2023.10457786

Hecht C., Slama JN., Sprenger M., Haubler F., Sippel M., Franke J.:
Laser Cleaning of Flux Residues on Copper Surfaces in Electronics Production
28th IEEE International Symposium for Design and Technology in Electronic Packaging, SIITME 2022 (Bucharest, ROU, 26. Oktober 2022 - 29. Oktober 2022)
In: 2022 IEEE 28th International Symposium for Design and Technology in Electronic Packaging, SIITME 2022 - Conference Proceedings 2022
DOI: 10.1109/SIITME56728.2022.9987997
Sippel M., Hassel S., Schmidt R., Sprenger M., Hecht C., Franke J.:
Impact of Aluminum Metallization Reconstruction on the Current Distribution in Power Semiconductors
9th IEEE Electronics System-Integration Technology Conference, ESTC 2022 (Sibiu, 13. September 2022 - 16. September 2022)
In: 2022 IEEE 9th Electronics System-Integration Technology Conference, ESTC 2022 - Proceedings 2022
DOI: 10.1109/ESTC55720.2022.9939542
Sprenger M., Noll N., Hecht C., De Greiff M., Müller L., Franke J.:
Parametric study on relevant design and material parameters for reliable hard encapsulation of automotive power modules
24th Electronics Packaging Technology Conference, EPTC 2022 (Singapore, 7. Dezember 2022 - 9. Dezember 2022)
In: Proceedings of the 24th Electronics Packaging Technology Conference, EPTC 2022 2022
DOI: 10.1109/EPTC56328.2022.10013218