Daniel Utsch

2025

• Utsch D., Turowski T., Hecht C., Thielen N., Ockel M., Franke J., Risch F.:
  Laser-Based Powder Bed Fusion of Copper Powder on Aluminum Nitride Ceramics for Power Electronic Applications
  In: Ceramics 8 (2025), p. 105
  ISSN: 2571-6131
  DOI: 10.3390/ceramics8030105

2024

• Siah KS., Ramaiya UB., Häußler F., Dörfler M., Utsch D., Voigt C., Franke J., Erdogan H.:
  Additively Printed Heating Structure for Radome De-icing Application
  47th International Spring Seminar on Electronics Technology, ISSE 2024 (Prague, 15. Mai 2024 - 19. Mai 2024)
  In: 2024 47th International Spring Seminar on Electronics Technology (ISSE) 2024
  DOI: 10.1109/ISSE61612.2024.10604114
• Utsch D., Sippel M., Voigt C., Häußler F., Franke J.:
  Assessment and improvement of adhesion of printed silver-based inks on alumina produced by fused filament fabrication
  In: Power Electronic Devices and Components 8 (2024), Article No.: 100067
  ISSN: 2772-3704
  DOI: 10.1016/j.pedc.2024.100067

2023

• Ankenbrand M., Panusch D., Utsch D., Banea K., Ehrngruber M., Gold G., Helmreich K., Franke J.:
  Generation of RF Structures on Additively Manufactured Substrates by Printed Electronics and Laser Structuring
  SMTA Pan Pacific Microelectronics Symposium 2023 (Kauai, 30. Januar 2023 - 1. Februar 2023)
  In: Proceedings of the SMTA Pan Pacific Microelectronics Symposium 2023 2023
  URL: https://smta.org/page/knowledge-search#conference-proceedings/proceedings-by-year/5e46de4c222bfe08592ecfd5/view-publication-details5/64517354b4950300283478bd/entry-details4/645174ed0e46690d6145b460/
• Hecht C., Schüller D., Utsch D., Stoll T., Franke J.:
  Investigations on processing copper-titanium powder blends via PBF-LB/M
  In: Lasers in Manufacturing, 2023
  URL: https://wlt.de/sites/default/files/2023-09/Contribution_112.pdf
• Utsch D., Bründl P., Franke J., Erdogan H.:
  Mechanical qualification and microstructural analysis of alumina produced by material extrusion
  In: Materials Science and Engineering A-Structural Materials Properties Microstructure and Processing (2023), p. 145456
  ISSN: 0921-5093
  DOI: 10.1016/j.msea.2023.145456
• Utsch D., Häußler F., Sprenger M., Zirn J., Franke J.:
  Reliability of Piezojet-Printed Conductive Lines on Alumina Substrates Produced by Fused Filament Fabrication
  2023 15th International Congress Mechatronic Integration Discourse (Amberg, 21. Juni 2023 - 22. Juni 2023)
  In: 2023 15th International Congress Mechatronic Integration Discourse (MID), New York: 2023
  DOI: 10.1109/MID59615.2023.10461318
• Utsch D., Häußler F., Voigt C., Sippel M., Franke J.:
  Optimizing Adhesion of Printed Conductive Lines on Additively Manufactured Ceramics
  46th International Spring Seminar on Electronics Technology (Timisoara, 10. Mai 2023 - 14. Mai 2023)
  DOI: 10.1109/ISSE57496.2023.10168526
• Voigt C., Petersen M., Thielen N., Utsch D., Häußler F., Kirchberger M., Franke J.:
  Analysis of the Suitability of Inkjet-Printed Ag-Particle-Filled Inks for Use in Connections of Fine-Pitch Electrical Components
  International Spring Seminar on Electronics Technology (Timisoara, 14. Mai 2023 - 17. Juli 2023)
  In: 2023 46th International Spring Seminar on Electronics Technology (ISSE) 2023
  DOI: 10.1109/ISSE57496.2023.10168387

2022

• Utsch D.:
  Additive4Industry - Printed electronics on 3D substrates. Mit keramischen Materialien zu temperaturbeständigeren elektronischen Baugruppen
  In: Cluster Mechatronik & Automation, Teil der Bayern Innovativ Bayerische Gesellschaft für Innovation und Wissenstransfer mbH (ed.): mechatroniknews, Nürnberg: , 2022, p. 2 - 4
  (Techreport)
• Utsch D., Milich N., Ankenbrand M., Franke J.:
  Herstellung räumlicher Schaltungsträger mit keramischen Materialien mittels digitaler Fertigungsverfahren
  11. DVS/GMM-Fachtagung - Elektronische Baugruppen und Leiterplatten EBL 2022 (Fellbach, 14. Juni 2022 - 15. Juni 2022)
  In: DVS Media GmbH (ed.): Elektronische Baugruppen und Leiterplatten EBL 2022 2022
• Utsch D., Piechulek N., Franke J.:
  Additive Manufacturing of 3D Circuit Carriers with Improved Thermal Conductivity
  45th International Spring Seminar on Electronics Technology (ISSE) (Wien, 11. Mai 2022 - 15. Mai 2022)
  DOI: 10.1109/ISSE54558.2022.9812778
• von Lindenfels J., Qomi MP., Utsch D., Franke J., Kühl A., Reibenweber L., Stadler A.:
  Electromagnetic Actuators Suitable for High Temperatures Using Thin Aluminum Foil as Conductor
  12th International Electric Drives Production Conference, EDPC 2022 (Virtual, Online, DEU, 29. November 2022 - 30. November 2022)
  In: 2022 12th International Electric Drives Production Conference, EDPC 2022 - Proceedings 2022
  DOI: 10.1109/EDPC56367.2022.10019743

2020

• Heisler P., Utsch D., Kuhn M., Franke J.:
  Optimization of wire harness assembly using human-robot-collaboration
  8th CIRP Conference of Assembly Technology and Systems, CATS 2020 (Athens, 29. September 2020 - 1. Oktober 2020)
  In: Sotiris Makris (ed.): Procedia CIRP 2020
  DOI: 10.1016/j.procir.2020.05.235
• Metzner M., Utsch D., Walter M., Hofstetter C., Ramer C., Blank A., Franke J.:
  A system for human-in-the-loop simulation of industrial collaborative robot applications
  16th IEEE International Conference on Automation Science and Engineering, CASE 2020 (Hong Kong, 20. August 2020 - 21. August 2020)
  In: IEEE International Conference on Automation Science and Engineering 2020
  DOI: 10.1109/CASE48305.2020.9216766