Dr.-Ing. Manuela Ockel

2026

• Gökçen A., Schickel J., Franke J., Ockel M.:
  Enhancing Functional Properties of Thin, Atmospheric Plasma-Sprayed Cu Coatings: A Comparative Study of Furnace and Laser Annealing
  ITSC 2026 International Thermal Spray Conference and Exhibition (Bangkok)
  DOI: 10.53192/ITSC2026634
• Ockel M., Dötsch C., Hanf T., Franke J.:
  Aeroacoustic Free-Field Microphony for Process Stability and Nozzle Clogging Detection in Atmospheric Plasma Spray
  ITSC 2026 International Thermal Spray Conference and Exhibition (Bangkok)
  DOI: 10.53192/ITSC2026504

2025

• Gökçen A., Ockel M., Petersen M., Thielen N., Franke J., Risch F.:
  Optimizing Thin Electric Functional Copper Coatings via Atmospheric Plasma Spray: Impact of Particle Temperature and Velocity
  ITSC 2025 (Vancouverr, 5. Mai 2025 - 8. Mai 2025)
  In: Thermal Spray 2025: Proceedings from the International Thermal Spray Conference 2025
  DOI: 10.31399/asm.cp.itsc2025p0192
• Ockel M., Albrecht I., Gökçen A., Thielen N., Franke J., Risch F.:
  Influence of Hydrogen-Enhanced Annealing on the Morphology of Atmospheric Plasma Sprayed Copper
  Thermal Spray 2025 (Vancouver, 6. Mai 2015 - 8. Mai 2025)
  In: Thermal Spray 2025: Proceedings from the International Thermal Spray Conference 2025
  DOI: 10.31399/asm.cp.itsc2025p0186
• Sprenger M., Fegus M., Ockel M., Hechtel M., Goth C., Franke J., Risch F.:
  Effect of Plasma Gas onto Epoxy Mold Compound Adhesion within Heatsink Attach of Power Modules
  2025 International Spring Seminar on Electronics Technology (ISSE) (, 14. Mai 2025 - 18. Mai 2025)
  In: 2025 International Spring Seminar on Electronics Technology (ISSE) 2025
  DOI: 10.1109/ISSE65583.2025.11120973
• Utsch D., Turowski T., Hecht C., Thielen N., Ockel M., Franke J., Risch F.:
  Laser-Based Powder Bed Fusion of Copper Powder on Aluminum Nitride Ceramics for Power Electronic Applications
  In: Ceramics 8 (2025), p. 105
  ISSN: 2571-6131
  DOI: 10.3390/ceramics8030105

2024

• Hecht C., Ockel M., Stoll T., Franke J.:
  Fabrication of metal-ceramic substrates by laser powder bed fusion using a high-power green laser and high temperature preheating
  SPIE LASE (San Francisco)
  In: Proceedings Volume 12876, Laser 3D Manufacturing XI 2024
  DOI: 10.1117/12.3001350
• Ockel M., Borchers A., Fröhlich J., Petersen M., Paschen T., Christiansen S., Franke J.:
  Atmospheric Plasma Spraying for Copper Coating of Ceramic Solid Electrolytes for Anode-Free Solid-State Batteries with Increased Interfacial Contact
  2024 1st International Conference on Production Technologies and Systems for E-Mobility (EPTS) (Bamberg, 5. Juni 2024 - 6. Juni 2024)
  In: 2024 1st International Conference on Production Technologies and Systems for E-Mobility (EPTS) 2024
  DOI: 10.1109/EPTS61482.2024.10586742
• Ockel M., Funk F., Janisch L., Franke J.:
  Evaluation of the Cold Atmospheric Plasma Metallization of Bare Dies with Copper Through Life Cycle Assessment
  In: Thomas Bauernhansl, Alexander Verl, Mathias Liewald, Hans-Christian Möhring (ed.): Production at the Leading Edge of Technology. Proceedings of the 13th Congress of the German Academic Association for Production Technology (WGP), Freudenstadt, November 2023, Cham: Springer Nature Switzerland, 2024, p. 417-427 (Lecture Notes in Production Engineering)
  ISBN: 978-3-031-47394-4
  DOI: 10.1007/978-3-031-47394-4_41
• Ockel M., Gökçen A., Ottinger B., Petersen M., Voigt C., Franke J.:
  Cold Atmospheric Plasma Metallization of Power Semiconductor Bare Dies with CuSn Pseudo-Alloys for Diffusion Soldering
  International Thermal Spray Conference and Exposition (Mailand, 29. April 2024 - 1. Mai 2024)
  In: ITSC 2024 International Thermal Spray Conference and Exposition. Conference Proceedings and Poster Sessions, Düsseldorf: 2024
• Ockel M., Meier S., Stelter O., Thielen N., Bründl P., Franke J.:
  Implementation of a Camera System for the Application of Artificial Intelligence in Monitoring the Cold Atmospheric Plasma Spray Process
  2024 32nd Mediterranean Conference on Control and Automation (MED) (Chania, 11. Juni 2024 - 14. Juni 2024)
  In: 2024 32nd Mediterranean Conference on Control and Automation (MED), New York City: 2024
  DOI: 10.1109/MED61351.2024.10566191
• Sprenger M., Forndran F., Öztürk B., Sippel M., Ockel M., Goth C., Franke J.:
  Influence of hard encapsulation onto reliability of soldered die-attach in power modules
  13th International Conference on Integrated Power Electronics Systems, CIPS 2024 (Dusseldorf, DEU, 12. März 2024 - 14. März 2024)
  In: ETG-Fachbericht 2024

2023

• Ockel M., Janisch L., Franke J., Schlichting J., Breuer M.:
  Enhancing Flexibility in Power Electronics Production: A Study on Robotic Handling of Copper Clips for Laser Bonding
  11th International Conference on Control, Mechatronics and Automation, ICCMA 2023
  DOI: 10.1109/ICCMA59762.2023.10374891
• Ockel M., Sippel M., Hecht C., Janisch L., Franke J.:
  A Conceptional Study towards Developing a Novel Copper Top-Side Interconnection Process in Power Electronics using Additive Manufacturing
  DOI: 10.1109/EPTC59621.2023.10457786

2022

• Ockel M., Hensel A., Franke J.:
  Suitability of a 2 kw 515 nm Continous Wave Laser for Deep Penetration Welding of Copper
  12th International Electric Drives Production Conference, EDPC 2022 (Virtual, 29. November 2022 - 30. November 2022)
  In: 2022 12th International Electric Drives Production Conference, EDPC 2022 - Proceedings 2022
  DOI: 10.1109/EDPC56367.2022.10019737
• Seidel R., Ockel M., Franke J., Kästle C.:
  Impact of THT-hole dimensioning on manufacturability in selective wave soldering
  In: Microelectronics Reliability 137 (2022), p. 114773
  ISSN: 0026-2714
  DOI: 10.1016/j.microrel.2022.114773