Markus Ankenbrand (M.Sc.)

2024

• Ankenbrand M., Panusch D., Piechulek N., Gold G., Helmreich K., Franke J.:
  Investigating Laser Direct Structuring and Aerosol-Jet for Additively Manufactured Helix Antennas
  23rd International Conference on Electronics Packaging, ICEP 2024 (Toyama, JPN, 17. April 2024 - 20. April 2024)
  In: 2024 International Conference on Electronics Packaging, ICEP 2024 2024
  DOI: 10.23919/ICEP61562.2024.10535565
• Ankenbrand M., Piechulek N., Mutlu E., Franke J.:
  Feasibility and Performance of Fully Additive Manufactured Light Bulbs
  26th Electronics Packaging Technology Conference, EPTC 2024 (Singapore, SGP, 3. Dezember 2024 - 6. Dezember 2024)
  In: Sunmi Shin, Chin Hock Toh, Yeow Kheng Lim, Vivek Chidambaram, King Jien Chui (ed.): Proceedings of the 26th Electronics Packaging Technology Conference, EPTC 2024 2024
  DOI: 10.1109/EPTC62800.2024.10909948
• Bartz M., Halmos F., Jüttner M., Ankenbrand M., Häusler F., Franke J., Wartzack S.:
  Use of printed sensors to measure strain in rolling bearings under isolated boundary conditions
  In: Konstruktion 76 (2024), p. 58-59
  ISSN: 0720-5953
• Bartz M., Häußler F., Halmos F., Ankenbrand M., Jüttner M., Franke J., Wartzack S.:
  Strain measurement on rolling bearings using sensors applied by aerosol-based deposition
  Bearing World (Würzburg, 25. Juni 2024 - 26. Juni 2024)
• Piechulek N., Ankenbrand M., Xu L., Fröhlich J., Nguyen H., Bründl P., Franke J.:
  Innovations and Challenges in Laser Direct Structured Mechatronic Integrated Devices for Aviation: Material Development, Component Design, and Additive Manufacturing
  26th Electronics Packaging Technology Conference, EPTC 2024 (Singapore, SGP, 3. Dezember 2024 - 6. Dezember 2024)
  In: Sunmi Shin, Chin Hock Toh, Yeow Kheng Lim, Vivek Chidambaram, King Jien Chui (ed.): Proceedings of the 26th Electronics Packaging Technology Conference, EPTC 2024 2024
  DOI: 10.1109/EPTC62800.2024.10909947

2023

• Ankenbrand M., Panusch D., Utsch D., Banea K., Ehrngruber M., Gold G., Helmreich K., Franke J.:
  Generation of RF Structures on Additively Manufactured Substrates by Printed Electronics and Laser Structuring
  SMTA Pan Pacific Microelectronics Symposium 2023 (Kauai, 30. Januar 2023 - 1. Februar 2023)
  In: Proceedings of the SMTA Pan Pacific Microelectronics Symposium 2023 2023
  URL: https://smta.org/page/knowledge-search#conference-proceedings/proceedings-by-year/5e46de4c222bfe08592ecfd5/view-publication-details5/64517354b4950300283478bd/entry-details4/645174ed0e46690d6145b460/
• Bartz M., Häußler F., Halmos F., Ankenbrand M., Jüttner M., Roudenko J., Wirsching S., Reichenberger M., Franke J., Wartzack S.:
  Use of Printed Sensors to Measure Strain in Rolling Bearings under Isolated Boundary Conditions
  In: Lubricants 11 (2023), p. 424
  ISSN: 2075-4442
  DOI: 10.3390/lubricants11100424
• Halmos F., Jüttner M., Bartz M., Ankenbrand M., Häusler F., Franke J., Wartzack S.:
  Einsatz von gedruckten Sensoren zur Messung der Dehnung von Wälzlagern unter isolierten Randbedingungen
  In: WiGeP News 2/2023 (2023)
  ISSN: 1613-5504
  URL: https://wigep.de/category/wigep-news/

2022

• Utsch D., Milich N., Ankenbrand M., Franke J.:
  Herstellung räumlicher Schaltungsträger mit keramischen Materialien mittels digitaler Fertigungsverfahren
  11. DVS/GMM-Fachtagung - Elektronische Baugruppen und Leiterplatten EBL 2022 (Fellbach, 14. Juni 2022 - 15. Juni 2022)
  In: DVS Media GmbH (ed.): Elektronische Baugruppen und Leiterplatten EBL 2022 2022

2019

• Ankenbrand M., Eiche Y., Franke J.:
  Programming and evaluation of a multi-Axis/multi-process manufacturing system for mechatronic integrated devices
  2019 International Conference on Electronics Packaging, ICEP 2019 (Niigata, 17. April 2019 - 20. April 2019)
  In: 2019 International Conference on Electronics Packaging, ICEP 2019 2019
  DOI: 10.23919/ICEP.2019.8733548
• Lomakin K., Ankenbrand M., Sippel M., Franke J., Helmreich K., Gold G.:
  Nanojet 3D Printed Coplanar Waveguides on Flexible Polyimide Substrate up to 24 GHz
  1st IEEE International Conference on Flexible and Printable Sensors and Systems (FLEPS 2019) (Glasgow, 7. Juli 2019 - 10. Juli 2019)
  DOI: 10.1109/fleps.2019.8792231
• Sippel M., Lomakin K., Ankenbrand M., Petersen M., Franke J., Helmreich K., Vossiek M., Gold G.:
  3D-Printed Bowtie Filter Created by High Precision NanoJet System Combined with Novel Printing Strategy
  28th Conference on Electrical Performance of Electronic Packages and Systems (EPEPS 2019) (Montreal)
  DOI: 10.1109/EPEPS47316.2019.193232

2018

• Ankenbrand M., Franke J., Lomakin K., Pavlenko T., Sippel M., Gold G., Weidner T., Weiß D., Helmreich K.:
  Erzeugung von 3D-Funktionsstrukturen fuer Hochfrequenzanwendungen durch Druckverfahren
  In: PLUS - Produktion von Leiterplatten und Systemen (2018)
• Ankenbrand M., Scheetz M., Franke J., Lomakin K., Sippel M., Gold G., Helmreich K.:
  Generation of 3D Functional Structures for High- Frequency Applications by Printing Technologies
  2018 13th International Congress Molded Interconnect Devices (MID)
  DOI: 10.1109/ICMID.2018.8527052
• Lomakin K., Pavlenko T., Ankenbrand M., Sippel M., Ringel J., Scheetz M., Klemm T., Gräf D., Helmreich K., Franke J., Gold G.:
  Evaluation and Characterization of 3D Printed Pyramid Horn Antennas utilizing different Deposition Techniques for Conductive Material
  In: IEEE Transactions on Components, Packaging and Manufacturing Technology (2018), p. 1-1
  ISSN: 2156-3950
  DOI: 10.1109/tcpmt.2018.2871931
• Lomakin K., Pavlenko T., Sippel M., Gold G., Helmreich K., Ankenbrand M., Urban N., Franke A.:
  Impact of Surface Roughness on 3D printed SLS Horn Antennas
  In: European Conference on Antennas and Propagation (EUCAP) 2018
  DOI: 10.1049/cp.2018.1235
• Lomakin K., Pavlenko T., Sippel M., Gold G., Weidner T., Helmreich K., Ankenbrand M., Franke J.:
  3D Printed Helix Antenna
  In: European Conference on Antennas and Propagation (EUCAP) 2018
  DOI: 10.1049/cp.2018.1034
• Lomakin K., Sippel M., Gold G., Fröhlich J., Helmreich K., Ankenbrand M., Franke J.:
  Low reflective aerosol Jet printed broadband matched load up to 67 GHz
  In: German Microwave Conference 2018
  DOI: 10.23919/gemic.2018.8335109
• Lomakin K., Sippel M., Gold G., Ringel J., Weiß D., Helmreich K., Ankenbrand M., Franke J.:
  Substituting bond wires by additively manufactured interconnections
  In: German Microwave Conference 2018
  DOI: 10.23919/gemic.2018.8335106

2017

• Lomakin K., Sippel M., Gold G., Rochholz P., Helmreich K., Ankenbrand M., Gräf D., Franke J.:
  Additive Fertigung in der Hochfrequenztechnik – Potenziale und Herausforderungen
  In: PLUS - Produktion von Leiterplatten und Systemen (2017)