Sven Meier

2025

• Mahr F., Freese G., Meier S., Kratsch C., Raum C., Thielen N., Franke J., Risch F.:
  Optimizing Semantic Search in Industrial Knowledge Retrieval: A Novel SHAP-Based Attention Mask Modification Approach
  2025 26th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) (Utrecht, 6. April 2025 - 9. April 2025)
  In: 2025 26th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE), New York City: 2025
  DOI: 10.1109/EuroSimE65125.2025.11006545
• Meier S., Raut PN., Mahr F., Thielen N., Franke J., Risch F.:
  Structured knowledge-based causal discovery: Agentic streams of thought
  In: Information Processing & Management 62 (2025), Article No.: 104202
  ISSN: 0306-4573
  DOI: 10.1016/j.ipm.2025.104202
• Rachinger B., Thielen N., Meier S., Franke J., Risch F.:
  Improving THT-AOI Image Classification through Federated Learning: A Study on Model Performance and Training Stability under Various Data Distributions
  IPC APEX EXPO 2025 (Anaheim, Kalifornien, 18. März 2025 - 20. März 2025)
  In: IPC APEX EXPO 2025 Technical Conference Proceedings, Bannockburn, Illinois: 2025

2024

• Meier S., Töper F., Gebele J., Rachinger B., Klarmann S., Franke J.:
  Knowledge Mining using Generative AI for Causal Discovery in Electronics Production
  47th International Spring Seminar on Electronics Technology, ISSE 2024 (Prague, 15. Mai 2024 - 19. Mai 2024)
  In: 2024 47th International Spring Seminar on Electronics Technology (ISSE) 2024
  DOI: 10.1109/ISSE61612.2024.10604102
• Ockel M., Meier S., Stelter O., Thielen N., Bründl P., Franke J.:
  Implementation of a Camera System for the Application of Artificial Intelligence in Monitoring the Cold Atmospheric Plasma Spray Process
  2024 32nd Mediterranean Conference on Control and Automation (MED) (Chania, 11. Juni 2024 - 14. Juni 2024)
  In: 2024 32nd Mediterranean Conference on Control and Automation (MED), New York City: 2024
  DOI: 10.1109/MED61351.2024.10566191
• Rachinger B., Seidel R., Meier S., Franke J.:
  Optimierung der Prozessparameter beim Selektivwellenlöten mit Hilfe von Offline Reinforcement Learning
  EBL Fellbach (Fellbach, 5. März 2024 - 6. März 2024)
  In: GMM-Fb. 107: EBL 2024 – Elektronische Baugruppen und Leiterplatten 2024
  URL: https://www.vde-verlag.de/buecher/456265/gmm-fb-107-ebl-2024-elektronische-baugruppen-und-leiterplatten.html
• Thielen N., Rachinger B., Schröder F., Preitschaft A., Meier S., Seidel R., Reinhardt A., Franke J.:
  Comparative Study on Different Methods to Generate Synthetic Data for the Classification of THT Solder Joints
  2024 1st International Conference on Production Technologies and Systems for E-Mobility (Bamberg, 5. Juni 2024 - 6. Juni 2024)
  In: 2024 1st International Conference on Production Technologies and Systems for E-Mobility (EPTS), New York City: 2024
  DOI: 10.1109/EPTS61482.2024.10586740

2023

• Meier S., Klarmann S., Thielen N., Pfefferer C., Kuhn M., Franke J.:
  A process model for systematically setting up the data basis for data-driven projects in manufacturing
  In: Journal of Manufacturing Systems 71 (2023), p. 1-19
  ISSN: 0278-6125
  DOI: 10.1016/j.jmsy.2023.08.024
• Seidel R., Rachinger B., Thielen N., Schmidt K., Meier S., Franke J.:
  Development and validation of a digital twin framework for SMT manufacturing
  In: Computers in Industry 145 (2023)
  ISSN: 0166-3615
  DOI: 10.1016/j.compind.2022.103831
• Thielen N., Wagner M., Meier S., Voigt C., Franke J.:
  Anomaly Detection for Dispensing of Solder Paste on 3D Circuit Carriers Using Machine Learning
  25th Electronics Packaging Technology Conference, EPTC 2023 (Singapore, 5. Dezember 2023 - 8. Dezember 2023)
  In: Andrew Tay, King Jien Chui, Yeow Kheng Lim, Chuan Seng Tan, Sunmi Shin (ed.): Proceedings of the 25th Electronics Packaging Technology Conference, EPTC 2023 2023
  DOI: 10.1109/EPTC59621.2023.10457873

2022

• Meier S., Albuquerque RQ., Demleitner M., Ruckdaeschel H.:
  Modeling glass transition temperatures of epoxy systems: a machine learning study
  In: Journal of Materials Science 57 (2022), p. 13991-14002
  ISSN: 0022-2461
  DOI: 10.1007/s10853-022-07372-9
• Meier S., Erkan A., Thielen N., Klarmann S., Franke J.:
  Attention-based Image Compression in Sensor Assembly
  28th IEEE International Symposium for Design and Technology in Electronic Packaging, SIITME 2022 (Bucharest, ROU, 26. Oktober 2022 - 29. Oktober 2022)
  In: 2022 IEEE 28th International Symposium for Design and Technology in Electronic Packaging, SIITME 2022 - Conference Proceedings 2022
  DOI: 10.1109/SIITME56728.2022.9987988
• Schwab M., Madeline-Derou C., Klarmann S., Thielen N., Meier S., Franke J., Chintanippu S., Stork W.:
  Multi-Model Machine Learning based Industrial Vision Framework for Assembly Part Quality Control
  27th IEEE International Conference on Emerging Technologies and Factory Automation, ETFA 2022 (Stuttgart, DEU, 6. September 2022 - 9. September 2022)
  In: IEEE International Conference on Emerging Technologies and Factory Automation, ETFA 2022
  DOI: 10.1109/ETFA52439.2022.9921587
• Thielen N., Pan W., Piechulek N., Voigt C., Meier S., Schmidt K., Franke J.:
  Machine Learning Based Quality Prediction for Solder Paste Dispensing in Electronics Production
  24th Electronics Packaging Technology Conference, EPTC 2022 (Singapore, SGP, 7. Dezember 2022 - 9. Dezember 2022)
  In: Proceedings of the 24th Electronics Packaging Technology Conference, EPTC 2022 2022
  DOI: 10.1109/EPTC56328.2022.10013210